Capabilities
| SMT assembly capacity: 19 million points/day | ||
| Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station |
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| Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
| Mounted Component Specifications | Pasteable smallest package | |
| Minimum device accuracy | ||
| IC type chip accuracy | ||
| Mounted PCB Specifications | Substrate size | |
| Substrate thickness | ||
| throw rate | 1. Resistance-capacitance ratio 0.3% | |
| 2. IC type without throwing material | ||
| Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
| DIP daily production capacity | ||
| DIP plug-in production line | 50000 points/day | |
| DIP post welding production line | 20000 points/day | |
| DIP test production line | 50000pcs PCBA/day | |
| PCB Assembly processing capability | ||
| The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
| PCBA processing capability | ||
| project | Mass processing capability | Small batch processing capability |
| Number of layers (max) | 2-28 | 20-30 |
| Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet |
PTFE, PPO, PPE |
| Rogers,etc Teflon | E-65, ect | |
| Sheet mixing | 4 layers - 6 layers | 6th floor - 8th floor |
| biggest size | 610mm X 1100mm | / |
| Dimensional Accuracy | ±0.13mm | ±0.10mm |
| Plate thickness range | 0.2mm--6.00mm | 0.2mm--8.00mm |
| Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
| Thickness tolerance (t＜0.8mm) | ±10% | ±8% |
| Media thickness | 0.076mm--6.00mm | 0.076mm--0.100mm |
| Minimum line width | 0.10mm | 0.075mm |
| Minimum spacing | 0.10mm | 0.075mm |
| Outer copper thickness | 8.75um--175um | 8.75um--280um |
| Inner layer copper thickness | 17.5um--175um | 0.15mm--0.25mm |
| Drilling hole diameter (mechanical drill) | 0.25mm--6.00mm | 0.15mm--0.25mm |
| Hole diameter (mechanical drill) | 0.20mm--6.00mm | 0.10mm--0.20mm |
| Hole Tolerance (Mechanical Drill) | 0.05mm | / |
| Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
| Laser Drilling Aperture | 0.10mm | 0.075mm |
| Plate thickness aperture ratio | 10：1 | 12：1 |
| Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
| Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
| Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
| Plug hole diameter | 0.25mm--0.60mm | 0.60mm-0.80mm |
| Impedance tolerance | ±10% | ±5% |
| Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board |
Immersion Tin, OSP |
| SMT main equipment process capability | ||
| machine | scope | Process parameters |
| Printing press GKG GLS | PCB printing seal | 50X50MM~610x510mm |
| Printing accuracy | ±0.018mm | |
| Frame size | 420×520mm—737×737mm | |
| PCB thickness range | 0.4-6mm | |
| All-in-one machine for stacking board | PCB conveying seal | 50X50MM~400x360mm |
| Unwinding machine | PCB conveying seal | 50X50MM~400x360mm |
| YAMAHA YSM20R | When transferring 1 board | L50×W50mm ～L810×W490mm |
| SMD theoretical speed | 95,000CPH ( 0.027sec / CHIP ) | |
| Mounting range | 0201(mm)-45*45mm component mounting height: less than 15mm | |
| Mounting accuracy | CHIP±0.035mm ( ±0.025mm ) Cpk ≧ 1.0 ( 3σ ) | |
| number of components | 140 kinds ( 8mm reel) | |
| YAMAHA YS24 | When transferring 1 board | L50×W50mm ～L700×W460mm |
| SMD theoretical speed | 72,000CPH ( 0.05sec / CHIP ) | |
| Mounting range | 0201(mm)-32*mm component mounting height: 6.5MM | |
| Mounting accuracy | ±0.05mm(μ+3σ) 、±0.03mm(3σ) | |
| number of components | 120 kinds ( 8mm reel) | |
| YAMAHA YSM10 | When transferring 1 board | L50×W50mm ～L510×W460mm |
| SMD theoretical speed | 46000CPH ( 0.078sec / CHIP ) | |
| Mounting range | 0201(mm)-45*mm component mounting height: 15MM | |
| Mounting accuracy | ±0.035mm (±0.025mm) Cpk ≧ 1.0 (3σ) | |
| number of components | 48 types ( 8mm reel) / 15 automatic IC trays | |
| JT TEA--1000 | Adjustable for each dual track | W50~270MM substrate / single track adjustable W50*W450mm |
| The height of components on the PCB board | 25MM up and down | |
| conveyor belt speed | 300~2000MM/MIN | |
| ALeader ALD7727D AOI Online | Resolution / Visual Range / Speed | Optional: 7µm/Pixel FOV: 28.62mm x 21.00mm Standard: 15µm/Pixel FOV: 61.44mm x 45.00mm |
| Detection speed | ＜230ms/FOV | |
| barcode system | Automatic barcode recognition ( 1D or 2D code ) | |
| PCB size range | 50×50mm(Min) ～510×300mm(Max) | |
| 1 track fixed | 1 track is fixed, 2 , 3 , 4 tracks can be adjusted, the minimum size between 2 and 3 tracks is 95mm , and the maximum size of 1 , 4 tracks is 700mm ; |
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| single track | The maximum width of the track is 550mm ; for double tracks: the maximum width of both tracks is 300mm (testable width); |
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| PCB thickness range | 0.2MM ~ 5mm | |
| PCB top and bottom clearance | Top Side of PCB : 30 mm Bottom Side of PCB : 60 mm | |
| SPI Stech | barcode system | Automatic barcode recognition ( 1D or 2D code ) |
| PCB size range | 50×50mm(Min) ～630×590mm(Max) | |
| precision | 1µm, Height : 0.37µm | |
| Repeatability | Less than 1µm (4sigma) Volume / Area : Less than 1% (4sigma) Height : Greater than 1µm (4sigma) |
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| FOV speed | 0.3s/FOV | |
| Reference point detection time | 0.5sec/pcs | |
| Maximum detection height | ±550µm~1200µm | |
| Bending PCB Maximum Measurement Height | ±3.5MM~±5MM | |
| Minimum pad pitch | 100µm ( based on a pad with a pad height of 1500µm ) | |
| Minimum measurement size | Rectangle 150µm, Round 200µm | |
| Component height on PCB | 40MM up and down | |
| PCB board thickness | 0.4~7MM | |
| Shansi XRAY inspection equipment VX1800 | Light tube voltage | 130V-160KV |
| light tube current | 0.15mA | |
| System magnification | 130 kV: 1500X 160 kV: 6000X | |
| Closed tube function | Closed tube optional 90KV and 130KV, high power penetration shielding layer effect is better, detection of samples below 1 micron |
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| Can detect samples at 70 degree angle | System magnification up to 6000 | |
| Light pipe focus size | 1um-3um | |
| Stage | 650mmX540mm | |
| geometric magnification | 300 times | |
| BGA detection | The magnification is larger, the image is clearer, and it is easier to see BGA virtual soldering and tin cracks |
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| Stage | X , Y , Z direction positioning can be carried out ; X- ray tube and X- ray detector direction positioning |
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